The Next Gen Packaging Committee of The Bengal Chamber of Commerce and Industry organized the 3rd edition of the BCC&I Packaging Conclave on 4th August 2023 in Bhubaneshwar. The theme was "NextGen Packaging: Smarter, Greener & its Preparedness for Global Play"

On the basis of the interest shown by the Industries Department, Government of Odisha, the Committee decided to organise its annual Conclave, this year in Bhubaneshwar. Odisha is a state which has received high investments in the food, food processing and pharmaceutical industry in the last few years. Odisha Government has also set up Investment Opportunities for Chemicals, Petrochemicals & Plastic Sector. Considering these factors, the committee deemed it fit to hold the Packaging Conclave in Bhubaneshwar as Odisha provides an ideal ground for the Packaging companies to grow.

The event turned out to be a successful one with the presence of Shri Hemant Sharma, IAS, Principal Secretary, Department of Industries, Government of Odisha as the Guest of Honour and delivered the Keynote Address. He stated that the plastic and packaging industry is treated as a priority sector in Odisha. He welcomed the investors and assured the investors of a red-carpet welcome in the state. The plastic and packaging industry is very important for sectors such as food processing sector, agri-retail, apparel etc. and without a robust plastic and packaging sector, these sectors cannot function well. Odisha is a logistically rich state. An extensive mesh of roadways and railways connects the industrial zones to other states facilitating efficient movement of goods and services, making it a destination of choice for industrial enterprises across the country and abroad.
For investment facilitation in the plastic and packaging sector, the State Government would provide land at concessional rates, capital investment subsidy, employment subsidy, exemptions on electricity duty, stamp duty etc. at a very comparative rate.

The other eminent speakers were Mr. R M Uthayaraja, Director – Manufacturing Business, Balmer Lawrie & Co. Ltd., Mr. P Anand, Mentor, The Next Gen Packaging Committee, BCC&I & VP - M&S, The Tinplate company of India Ltd. , Mr. Ronojoy Basu, Chairman, The Next Gen Packaging Committee, BCC&I & Area Sales Manager, Middle East & South East Asia, Emerson + Renwick Group, Mr. Piyush Mangal, Director Commercial, Signode India Limited, Mr. Ramanathan Balasubramaniam, Head Sales- JSW Tinplate, Mr. Hariharan K Nair, President – Creativity & Innovation, Essel Propak Ltd. and many more.

The Conclave was well attended by participants who were printing & packaging technology providers, corrugated box manufacturers, Polymer Maufacturers, manufacturers of agrochemicals, industrial chemicals, chemical intermediates, and specialty chemicals, Packaging Machine manufacturers, Plastic Manufacturers Association, Packaging Companies, End users that belongs to fertilizer companies, health care companies, food processing companies and  Institutes like – CIPET & KIIT.  
The Conclave was organized under the able guidance of Mr. P Anand, Mentor, The Next Gen Packaging Committee, BCC&I & VP - M&S, The Tinplate company of India Ltd.  and Mr. Ronojoy Basu, Chairman, The Next Gen Packaging Committee, BCC&I & Area Sales Manager, Middle East & South East Asia, Emerson + Renwick Group.